SMT chip processing

SMT330-X SMT Автоматический светодиодный светильник

Название: SMT330-X SMT Автоматическое светодиодное оборудование SMD
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: HASL/бессвинцовый HASL
Паяльная маска: зеленая, синяя, белая, красная и т. д.
Применение: PCB SMT LED SMD

SMT/DIP на 1~40 слоев обработки

Название: 1 ~ 40 слоев обработки чипов SMT/Dip
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Материал:: ФР4/Подгонянный
Количество этажей:: 1–40 слоев по индивидуальному заказу.
Цвет паяльной маски:: Настроить. Черный. Зеленый. Красный. фиолетовый
Толщина меди: 1 унция/по индивидуальному заказу

SMT PCBA Прототип электроники

Имя: SMT PCBA Прототип электроники
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 1-5 унций
Основной материал: FR4, высокий Tg FR4, общий Tg FR4, средний Tg FR4
Поверхностная обработка: HASL, OSP, иммерсионная лента
Толщина доски: по индивидуальному заказу

Сборка печатной платы SMT PCBA

Название: Сборка печатной платы SMT PCBA
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: Индивидуальные
Цвет паяльной маски: зеленый, желтый, черный, синий, красный, белый, матовый зеленый.
Слой: 1-40
Базовый материал: FR-4/алюминий/керамика/cem-3/FR-1
Применение: Бытовая электроника
Толщина меди: 1/2 унции 1 унция 2 унции 3 унции

Печатная плата для обработки чипов SMT

Название: Печатная плата для обработки чипов SMT
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Количество слоев: 1-40 слоев, 1-40 слоев.
Базовый материал: Fr4, алюминий
Толщина платы: по индивидуальному заказу
Поверхностная обработка: Иммерсионное золото/хасл/хасл без свинца

Our SMT (Surface Mount Technology) Chip Processing service offers precise and efficient handling of surface mount chips for your electronic assembly needs. With our advanced equipment and skilled technicians, we provide professional chip processing solutions that meet the highest industry standards.

SMT chip involves the accurate placement, alignment, and soldering of surface mount chips onto printed circuit boards (PCBs). Whether you require small chip-scale packages or larger integrated circuits, our team has the expertise to handle a wide range of chip sizes and types.

Advantages of SMT chip processing:

  1. Precision placement: Our state-of-the-art pick-and-place machines ensure precise placement of surface mount chips onto PCBs. This results in accurate alignment of the chips, facilitating optimal electrical connections and reliable performance of your electronic devices.
  2. High-speed processing: SMT chip utilizes automated machinery to handle a large number of chips in a short period. This high-speed processing capability allows for efficient production cycles, reducing manufacturing time and costs.
  3. Miniaturization: Surface mount chips enable the miniaturization of electronic devices due to their smaller size compared to through-hole components. By utilizing SMT chip processing, you can design and produce compact and lightweight products without compromising functionality.
  4. Improved electrical performance: Surface mount chips offer improved electrical performance due to shorter trace lengths and reduced parasitic effects. This leads to enhanced signal integrity, lower electromagnetic interference, and improved overall functionality of your electronic products.
  5. Compatibility with advanced technologies: SMT chip supports the use of advanced chip technologies, such as microcontrollers, sensors, and integrated circuits. It enables the integration of complex functionalities and supports the latest advancements in the electronics industry.


Item Process Capability Parameter
Order Quantity ≥1PC
Quality Grade IPC-A-610
Lead Time 24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.
Size 50*50mm~510*460mm
Board Type Rigid PCB, Flexible PCB, metal core PCB
Min Package 01005 (0.4mm*0.2mm)
Max Package No limit
Mounting Accuracy ±0.035mm(±0.025mm)  Cpk≥1.0 (3σ)
Surface Finish Lead/Lead-free HASL, Immersion gold, OPS, etc.
Assembly Types Surface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole)
Component Sourcing Turnkey (All components sourced by PCBMay), Partial turnkey, Kitted/Consigned
BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
SMT Parts Presentation Cut Tape, Partial reel, Reel,Tube, Tray, Laser-cut Stainless Steel
Cable Assembly We supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment.
Stencil Stencil with or without frame (offered free by PCBMay)
Quality Inspection Visual inspection; AOI checking; BGA placement – X-RAY checking
SMT Capacity 3 Million~4 Million Soldering Pad/day
DIP Capacity 100 Thousand Pins/day

Automatic Solder Paste Printing Machine

AOI Optical Inspection

Smt High-Speed Placement Machine

Nitrogen Reflow Soldering


Three Anti-Paint Spraying Machine

SPI Solder Paste Thickness Tester

Automatic Wave Soldering Machine

First Article Inspection

SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP

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