Single-sided PCB assembly

Односторонние печатные платы PCBA

Название: Односторонние печатные платы PCBA
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 1/3 унции – 4 унции или на заказ
Материал: ФР4
Паяльная маска: зеленая, синяя, белая, красная и т. д.
Толщина платы: по индивидуальному заказу

Одиночная двухсторонняя пайка SMT оплавлением

Название: Одиночная двусторонняя пайка SMT оплавлением
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Обработка поверхности: HASL, HAL-LF, OSP, ENIG
Паяльная маска: зеленая, синяя, белая, черная, серая, красная, желтая, фиолетовая.
Материал: FR4/алюминий

Однослойная печатная плата ST серии

Имя: Однослойная печатная плата лампы ST серии ster
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: HASL, не содержит свинца
Применение: Промышленное ламповое оборудование.
Материал: FR4/алюминий
Толщина меди: 1-5 унций
Паяльная маска: зеленая, синяя, белая, черная, серая, красная, желтая, фиолетовая.

Односторонняя печатная плата в сборе OEM Pcb и Pcba

Имя: Односторонняя сборка печатной платы OEM Pcb & Pcba
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: HASL/без свинца
Применение: сервис pcba
Базовый материал: RF4
Толщина платы: по индивидуальному заказу

Однослойная и многослойная печатная плата для радиоуправления

Название: Однослойная и многослойная печатная плата для  радиоуправления
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: ENIG,HASL,OSP,ENEPIG
Размер платы: индивидуальный
Цвет паяльной маски: Желтый PI
Применение: связь

Односторонняя печатная плата со светодиодами в сборе

Название: Односторонняя сборка печатной платы со светодиодами
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Количество слоев: 4-слойный
Основной материал: FR4, CEM3, PTFE, алюминий и т. д.
Поверхностная обработка: HASL, OSP, иммерсионное золото/олово
Паяльная маска: зеленая, черная, синяя, красная, матовая зеленая.
Применение: Электронное устройство

Our Single-Sided PCB Assembly service provides a cost-effective and efficient solution for your electronic assembly needs. With our state-of-the-art equipment and skilled technicians, we offer reliable assembly of single-sided printed circuit boards (PCBs) with precision and quality.

Single-sided PCBs are ideal for simple electronic designs and applications that require fewer components. Our assembly process ensures that each component is expertly placed and soldered onto the single copper layer, guaranteeing optimal electrical conductivity and performance.

Advantages of Single-sided PCB assembly:

  1. Cost-effective: Single-sided PCBs are more economical compared to multi-layered boards. They require fewer materials and involve simpler manufacturing processes, resulting in cost savings without compromising quality.
  2. Simplified assembly: With only one layer of components and traces, the assembly process is straightforward and streamlined. This reduces the complexity of the assembly, minimizing the chances of errors and facilitating faster production cycles.
  3. Quick prototyping: Single-sided PCB assembly is an excellent choice for rapid prototyping. With fewer components and simpler designs, you can accelerate the development cycle and quickly validate your electronic concepts.
  4. Space-efficient: Single-sided PCBs are compact and space-efficient. They are suitable for applications where size constraints are a concern, such as portable devices or space-limited electronic systems.
  5. Versatility: Despite their simplicity, single-sided PCBs can still accommodate a wide range of electronic components and support various functionalities. They are suitable for applications that do not require complex circuitry or high-density designs.


SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP

Automatic Solder Paste Printing Machine

AOI Optical Inspection

Smt High-Speed Placement Machine

Nitrogen Reflow Soldering


Three Anti-Paint Spraying Machine

SPI Solder Paste Thickness Tester

Automatic Wave Soldering Machine

First Article Inspection

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