Multilayer PCB

Multilayer PCB 8 layer

8-слойная печатная плата ENIG для автомобильной промышленности по индивидуальному заказу

Название: Многослойная печатная плата

Применяется для:: Портативный DVD-плеер, контроллер спа, светодиодная лампа, концентратор

Слой: 8-слойная многослойная печатная плата

Цвет паяльной маски: зеленый/белый/синий/красный

Цвет шелковой ширмы: белый/черный

Минимальная длина следа: 3 мил (0,75 мм)

Минимальное пространство: 3 мил (0,75 мм)

Применение: Бытовая электроника

Multilayer Printed Circuit Board

Изготовление многослойных печатных плат (PCB)

Название: Многослойная печатная плата

Материал: КБ6061, С1141, С1000, ИТ180.

Слой: 4-слойная – 48-слойная многослойная печатная плата

Цвет паяльной маски: зеленый/белый/синий/красный

Цвет шелковой ширмы: белый/черный

Готовая толщина: 0,3–6,0 мм.

Толщина меди: 0,5-6 унций

Обработка поверхности: Иммерсионное золото/OSP/HASL

Минимальная длина следа: 3 мил (0,75 мм)

Минимальное пространство: 3 мил (0,75 мм)

Применение: Бытовая электроника

PCB платы для медицинских устройств

Название: Печатная плата медицинского устройства

Субстрат: FR4

Ламинат: 8л

Диэлектрическая проницаемость: 4,2

Толщина пластины: 1,6 мм

Толщина внешней медной фольги: 1 унция

Толщина внутренней медной фольги: 1 унция

Минимальная апертура: 0,2 мм

Минимальная ширина линии: 0,1 мм

Минимальный межстрочный интервал: 0,1 мм.

Толщина золота: 1U”

Область применения: медицинская печатная плата

14-слойная печатная плата

Название: 14-слойная печатная плата

Слои: 14л.

Лист: ФР4 Тг180

Толщина пластины: 2,4 мм

Размер панели: 120*95 мм/1

Внешняя толщина меди: 35 мкм

Толщина меди внутреннего слоя: 35 мкм.

Минимальное сквозное отверстие: 0,20 мм.

Минимальный BGA: 0,25 мм

Ширина линии, межстрочный интервал: 3/3,2 мил.

Обработка поверхности: Иммерсионное золото 2U”

Область применения: автомобильная печатная плата


Introducing our multilayer PCB, designed to meet the increasing complexity and density requirements of modern electronic systems. Our multilayer PCBs offer enhanced functionality, improved signal integrity, and efficient use of space by incorporating multiple layers of conductive traces and insulating materials.

Our multilayer PCBs are suitable for a wide range of applications, including telecommunications, data storage, medical devices, aerospace, also consumer electronics, and more.

With their ability to accommodate high-speed signals, reduce electromagnetic interference, and provide design flexibility, our multilayer PCBs are the ideal choice for demanding electronic designs.

Key Features of Multilayer PCB:

  1. High Density and Space Optimization: Multilayer PCBs provide a higher level of component density and space optimization compared to single or double-sided PCBs. By stacking multiple layers of conductive traces and insulating materials, these PCBs allow for more compact designs, increased routing flexibility.
  2. Enhanced Signal Integrity: Multilayer PCBs offer improved signal integrity by providing dedicated signal layers and power/ground planes. The use of separate signal layers helps reduce crosstalk, noise, and electromagnetic interference (EMI), ensuring reliable signal transmission and also minimizing signal degradation in high-speed and high-frequency applications.
  3. Power Distribution and Grounding: Multilayer PCBs enable efficient power distribution and grounding. The inclusion of power and ground planes throughout the PCB ensures stable power supply and minimizes voltage drops. These planes also act as shielding layers, reducing electromagnetic emissions and enhancing system performance.
  4. Design Flexibility: Multilayer PCBs provide greater design flexibility compared to single or double-sided PCBs. They support complex circuitry, high-density component placement, and intricate routing patterns. This flexibility allows for the integration of advanced functionalities, such as high-speed interfaces, impedance matching, differential signaling, and RF/microwave circuitry.
  5. Reduced Electromagnetic Emissions: The use of dedicated ground and power planes in multilayer PCBs helps minimize electromagnetic emissions. This is crucial in applications where electromagnetic compatibility (EMC) is a concern, as it helps ensure compliance with regulatory standards and reduces the risk of interference with other electronic devices.


Multilayer PCB Production Capability
Item Capability
Layer Count 1-40layers
Base Material KBShengyiShengyiSF305FR408FR408HRIS410FR406GETEK370HRIT180ARogers4350BRogers4000PTFE Laminates(Rogers seriesTaconic seriesArlon seriesNelco series)Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)
Board Type BackplaneHDIHigh multi-layer blind&buried PCBEmbedded CapacitanceEmbedded resistance board Heavy copper power PCBBackdrill.
Board Thickness 0.2-5.0mm
Copper Thickness Min. 1/2 OZ, Max. 10 OZ
PTH Wall 25um(1mil)
Maximum Board Size 1100*500mm(43”*19”)
Min laser drilling size 4mil
Min. Spacing/Tracing 2.7mil/2.7mil
Solder Mask Green, Black, Blue, Red, White, Yellow, Purple matte/glossy
Surface Treatment Flash gold(electroplated gold)ENIGHard goldFlash goldHASL Lead-free OSPENEPIGSoft goldImmersion silverImmersion TinENIG+OSP, ENIG+Gold finger, Flash gold(electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger.
Min. Annular Ring 3mil
Aspect ratio 10:1(HASL Lead-free HASL LeadENIGImmersion TinImmersion silverENEPIG);8:1(OSP)
Impedance control ±5ohm(50ohm), ±10%(≥50ohm)
Other Techniques Blind/Buried Via
Gold Fingers
Press Fit
Via in Pad
Electrical Test

PCB Drilling machine

PCB pattern plating line

PCB solder mask expose machine

PCB pattern expose machine

Strip film etching line

Solder mask screen silk print machine

Solder mask scrubbing line

PCB Flying Probe Test (FPT)

Fully automatic exposure machine

Why choose us?
24-hour customer service

we provide 24-hour service and support, you will receive a reply to your question within 2 hours and a quotation within 24 hours.

timely delivery

Own PCB factory of 50,000 square meters, the monthly output can reach 60,000 square meters, no minimum PCB order requirements

Free DFM service

Before the official production of the PCB, we will conduct a free DFM review service and support free Allegro, Altium, Protel, PADS, OBD, Gerber and other formats.

Quality assurance

We can provide you with high frequency, high TG, high CTI, buried blind via, aluminum based PCB manufacturing, the quality is fully compliant with IPC 610-D standard, testing and quality assurance

Multilayer PCB FAQ
1.What is a multilayer PCB?
A multilayer PCB is a type of printed circuit board that consists of multiple layers of conductive traces and insulating layers stacked together. It allows for increased complexity, density, and functionality compared to single or double-sided PCBs.
2. Why would I choose a multilayer PCB?
Multilayer PCBs are chosen for their ability to handle complex circuits, high-density component placement, and improved signal integrity. They are ideal for applications that require multiple connections, high-speed data transfer, and miniaturization.
3. How many layers can a multilayer PCB have?
Multilayer PCBs can have varying numbers of layers, typically ranging from 4 to 16 layers or more. The number of layers depends on the complexity of the circuit, space constraints, and specific requirements of the application.
4. What are the advantages of using a multilayer PCB?
Increased circuit density: Multilayer PCBs provide more space for routing traces and placing components, allowing for higher density and more complex designs. Improved signal integrity: Dedicated power and ground planes, along with reduced trace lengths, help minimize noise and improve signal quality. EMI/EMC control: Multilayer PCBs with proper grounding techniques and shielding can effectively reduce electromagnetic interference (EMI) and improve electromagnetic compatibility (EMC). Compact size: Multilayer PCBs allow for size reduction as more circuitry can be packed into a smaller footprint. Enhanced thermal management: Multiple layers provide space for thermal vias and heat dissipation, helping manage heat generated by components.
5. How are the layers connected in a multilayer PCB?
Layers in a multilayer PCB are interconnected using vias, which are small conductive holes that allow electrical connections between different layers. There are two types of vias: through-hole vias that penetrate all layers and blind vias that connect only a subset of layers.
6. Can I design a multilayer PCB myself?
Designing a multilayer PCB requires expertise in PCB design tools, understanding of layer stack-up, routing guidelines, and considerations for signal integrity and manufacturing constraints. It is recommended to have experience in multilayer PCB design or seek assistance from a professional PCB design engineer.
7. Are multilayer PCBs more expensive than single or double-sided PCBs?
Multilayer PCBs are generally more expensive due to the additional manufacturing steps involved, such as layer alignment, lamination, and the use of specialized equipment. The cost also increases with the number of layers and complexity of the design.
8. Can multilayer PCBs be used in any application?
Multilayer PCBs are widely used in various applications, including consumer electronics, telecommunications, industrial equipment, automotive systems, medical devices, and more. They are suitable for applications that require increased functionality, high-speed data transfer, and miniaturization.

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