Medical PCB Assembly

Сборка печатных плат для медицинских ультразвуковых систем

Название: Сборка печатных плат для медицинских ультразвуковых систем
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: Иммерсионное золото
Цвет паяльной маски: синий. зеленый. красный. черный. белый. и т. д.
Базовый материал: FR-4
Толщина меди: 1 унция, 1 унция

Сборка плат для фитнес устройств

Название: Сборка плат для фитнес устройств
Происхождение: Китай
Сертифицировано: UL, CE, RoSH.
Количество слоев: 12 слоев
Толщина платы: 0,2-3 мм, 1,6-3,2 мм
Поверхностная обработка: HASL LF; ЭНИГ; ОСП; Твердое золото; Погружная банка ;ENEPIG
Толщина меди: 0-13 унций меди

Сборка печатной платы имплантируемого устройства

Название: Сборка печатной платы имплантируемого устройства – медицинская печатная плата
Происхождение: Китай
Сертифицировано: UL, CE, RoSH.
Количество слоев: 12 слоев
Толщина меди: 0-13 унций меди
Поверхностная обработка: HASL LF; ЭНИГ; ОСП; Твердое золото; Погружная банка ;ENEPIG
Толщина платы: 0,2-3 мм, 1,6-3,2 мм

Медицинская печатная плата сканирующего устройства

Название: Медицинская печатная плата сканирующего устройства
Происхождение: Китай
Сертифицировано: UL, CE, RoSH.
Толщина меди: 1 унция
Обработка поверхности: ENIG, HASL, OSP и т. д.
Паяльная маска: синяя
Слои: 4 слоя

Монитор печатной платы в сборе, медицинское устройство

Название: Медицинское устройство в сборе с печатной платой монитора
Происхождение: Китай
Сертифицировано: UL, CE, RoSH.
Толщина платы: 0,2-7,0 мм
Поверхностная обработка: HASL\OSP\погружное золото
Толщина меди: на заказ
Цвет паяльной маски: синий. зеленый. красный.
Применение: Электронное устройство

Сборка медицинских плат для лабораторного анализа

Название: Сборка медицинских плат для лабораторного анализа
Происхождение: Китай
Сертифицировано: UL, CE, RoSH.
Толщина меди: 4 унции
Поверхностная обработка: HASL, OSP, ENIG, иммерсионное золото…
Количество слоев: 1–20л
Толщина платы: 0,4 мм–3,2 мм

Medical PCB Assembly is a specialized electronic manufacturing service that focuses on the assembly of printed circuit boards (PCBs) for medical applications. It involves the precise and reliable assembly of PCBs that meet the stringent requirements of the medical industry, including accuracy, reliability, safety, and compliance with medical regulations and standards.

Medical PCB plays a crucial role in the production of electronic devices and equipment used in various medical applications, such as diagnostic equipment, patient monitoring systems, imaging devices, therapeutic devices, and more. These assemblies are designed to withstand rigorous operating conditions, ensure patient safety, and provide reliable performance in critical medical environments.

Key Features and Advantages of Medical PCB Assembly:

  1. Compliance with Medical Standards: Medical Assembly adheres to specific medical standards and regulations, such as ISO 13485 and IEC 60601, to ensure that the assembled PCBs meet the required safety and quality standards for medical devices. This includes proper documentation, traceability, risk management, and quality control processes.
  2. Precision and Accuracy: Medical PCB focuses on achieving high precision and accuracy in the assembly process. This includes precise placement of components, accurate soldering, and meticulous quality control measures to ensure the reliable performance of the medical devices and equipment.
  3. Component Selection and Traceability: Medical PCB carefully selects components that are suitable for medical applications, considering factors such as reliability, longevity, and biocompatibility. It also ensures component traceability, maintaining records of component sources, lot numbers, and certifications for quality control and future reference.
  4. EMI/EMC Compliance: Medical devices often operate in sensitive medical environments and require compliance with electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards. Medical PCB Assembly incorporates shielding techniques, grounding strategies, and appropriate component placement to minimize EMI and ensure reliable operation without interfering with other medical equipment.
  5. Sterilization Compatibility: Some medical devices and equipment require sterilization processes. Medical PCB considers the compatibility of materials, components, and PCB finishes with various sterilization methods, such as steam sterilization, ethylene oxide (EO) sterilization, or gamma radiation sterilization.

 

SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP
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Automatic Solder Paste Printing Machine

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AOI Optical Inspection

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Smt High-Speed Placement Machine

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Nitrogen Reflow Soldering

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X-Ray

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Three Anti-Paint Spraying Machine

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SPI Solder Paste Thickness Tester

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Automatic Wave Soldering Machine

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First Article Inspection

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