Low Volume PCB Assembly

Low Volume PCB Assembly

Гибкая сборка печатной платы малого объема

Название: Гибкая сборка печатной платы малого объема — идеально подходит для аэрокосмической отрасли
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Основной материал: медь или алюминий.
Толщина меди: 2 унции
Поверхностная обработка: Золотой палец, иммерсионное серебро, иммерсионное олово
Цвет паяльной маски: желтый. Необязательный
Применение: Бытовая электроника

Гибкая сборка печатной платы малого объема для цифровых камер и мобильных телефонов

Название: Гибкая сборка печатной платы малого объема для цифровых камер и мобильных телефонов
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Основной материал: медь или алюминий.
Поверхностная обработка: Золотой палец, иммерсионное серебро, иммерсионное олово
Толщина меди: 2 унции
Цвет паяльной маски: желтый. Необязательный
Толщина платы: по индивидуальному заказу

Высокочастотная сборка печатной платы малого объема

Название: Высокочастотная сборка печатной платы малого объема
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: OSP, HASL, иммерсионное золото, иммерсионное олово и т. д.
Толщина меди: 1 унция, 2 унции, 3 унции, 4 унции, 5 унций
Толщина платы: 0,3-3,5 мм
Паяльная маска: зеленая, черная, синяя, красная, белая и т. д.

Медная сборка печатной платы для электроники

Название: Тяжелая медная низкая сборка печатной платы для электроники
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 1 унция
Цвет паяльной маски: двусторонний зеленый LPI, также поддерживается красный, белый, желтый, синий, черный
Толщина платы: по индивидуальному заказу

Сборка печатных плат малого объема HDI для специального оборудования

Название: Сборка печатных плат малого объема HDI специально для оборудования
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 4 унции
Область применения: LED ГУБЫ
Толщина меди: 4 унции
Толщина платы: Массовое производство: 394 мил (10 мм). Образцы: 17,5 мм.
Слой: 1-64 л
Поверхностная обработка: HASL, OSP, иммерсионное золото/серебро/олово, ENIG, Gold Finger

Светодиодная печатная плата малого объема

Имя: Сборка печатной платы малого объема СИД для потребительского применения
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: OSP, HASL, иммерсионное золото, иммерсионное олово и т. д.
Паяльная маска: зеленая, черная, синяя, красная, белая и т. д.
Толщина платы: 0,3-3,5 мм
Толщина меди: 1 унция, 2 унции, 3 унции, 4 унции, 5 унций

Low Volume PCB Assembly is a specialized electronic manufacturing service that caters to the production of printed circuit boards (PCBs) in small quantities. It is designed to accommodate low-volume production runs, prototypes, or custom-made PCBs that do not require large-scale manufacturing processes.

Low Volume PCB Assembly offers cost-effective solutions for projects with lower production quantities, providing flexibility, customization, and quick turnaround times. It is ideal for applications such as research and development, proof-of-concept prototypes, specialized equipment, and niche markets.

Key Features and Advantages of Low-Volume PCB Assembly:

  1. Flexibility and Customization: Low Volume Assembly offers flexibility in accommodating customized designs, specific requirements, and design iterations. It allows for the incorporation of unique components, specialized features, and custom layouts to meet the specific needs of the project.
  2. Cost-Effectiveness: Low Volume Assembly is cost-effective for small production quantities, as it eliminates the high upfront costs associated with large-scale production processes. It allows for cost optimization without sacrificing quality. This makes it suitable for projects with budget constraints or limited market demand.
  3. Quick Turnaround Time: Low Volume Assembly typically provides faster turnaround times compared to high-volume production. With streamlined processes and reduced manufacturing queues, the assembly can be completed more rapidly. This enables prompt delivery of prototypes or low-volume PCB orders.
  4. Design Validation and Prototyping: Low Volume Assembly is an excellent choice for design validation and prototyping purposes. It allows engineers and designers to test and refine their designs before moving to full-scale production. It also provides an opportunity to identify and address any design issues, functionality concerns, or performance improvements at an early stage.
  5. Quality Control and Testing: Despite the lower production quantities, Low Volume PCB Assembly still adheres to rigorous quality control and testing processes. This also ensures that each assembled PCB meets the required specifications and functionality. Testing may include visual inspection, automated optical inspection (AOI), functional testing, and other relevant quality assurance measures.

 

SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP
https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-1.webp

Automatic Solder Paste Printing Machine

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AOI Optical Inspection

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-3.webp

Smt High-Speed Placement Machine

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-4.webp

Nitrogen Reflow Soldering

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-5.webp

X-Ray

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-6.webp

Three Anti-Paint Spraying Machine

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Assembly-Equipment-7.webp

SPI Solder Paste Thickness Tester

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Automatic Wave Soldering Machine

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First Article Inspection

Leadsintec
Why choose us?
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Efficient quotation

Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.

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All-round and reliable parts supplier

Leadsintec cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.

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Advanced equipment

It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.

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Quality assurance

We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.

Leadsintec
Low Volume PCB Assembly FAQ
1. Do you have low volume PCB assembly?
We mainly focus on high-quality PCBA services of "multi-variety, small and medium batches, and short delivery time"
2. What is Low Volume PCB Assembly?
Usually under 100 pieces are classified as low-volume PCB assembly services, which requires a reliable PCB assembler to meet these needs.
3. What are the advantages of small batch PCBA assembly?
Low-volume PCBA assembly can provide high turnaround times without leaving PCBA boards stuck in high unusable inventory.

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