Лучший производитель печатных плат для антенн в Китае
Название: Лучший производитель печатных плат для антенн в Китае
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Базовый материал: FR4, Роджерс
Толщина меди: 0,5-6 унций
Толщина платы: по индивидуальному заказу
Цвет паяльной маски: синий. зеленый. красный. черный. белый. и т. д.
Производитель промышленных печатных плат Bluetooth в Китае
Название: Производитель промышленных печатных плат Bluetooth в Китае
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Количество слоев: 4-слойный
Базовый материал: FR4
Толщина меди: 1 унция ~ 4 унции
Толщина платы: по индивидуальному заказу
Поверхностная обработка: ХАСЛ
Паяльная маска: зеленая. Красный. Синий. Белый. Черный. Желтый
Сборка PCB плат для автомобильной промышленности при работе в тяжелых условиях
Название: Сборка PCB плат для автомобильной промышленности при работе в тяжелых условиях
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Базовый материал: FR-4
Толщина платы: по индивидуальному заказу
Поверхностная обработка: HASL, не содержит свинца
Производитель печатных плат для микроволновых печей
Название: Сборка печатных плат производителя печатных плат микроволновой печи
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 2 унции, 1 унция, 2 унции, 3 унции, 4 унции, 5 унций
Область применения: Бытовая техника; Медицинская продукция; Бытовая электроника
Материал: FR-4, стеклоэпоксидная смола, FR4 High Tg, соответствует требованиям RoHS, алюминий.
Сборка печатной платы промышленного кондиционера
Название: Сборка печатной платы промышленного кондиционера – Leadsintec
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Применение: Бытовая техника
Поверхностная обработка: HASL\OSP\ENIG
Материал: FR4 High Tg
Паяльная маска: Черный Зеленый Синий Красный Желтый
Толщина меди: Настроить
Производитель печатных плат для аэрокосмической отрасли в Китае
Название: Производитель сборок печатных плат для аэрокосмической отрасли в Китае
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Цвет паяльной маски: Желтый; Черный; Белый;
Применение: Электронный продукт
Толщина меди: 1 унция
Материал: FR4 CEM1 CEM3 Высота TG
- PCB Assembly Capability
- PCB Assembly Equipment
Industrial PCB Assembly is a specialized electronic manufacturing service that caters to the unique requirements of industrial applications. It also involves the assembly of printed circuit boards (PCBs) specifically designed for industrial equipment, machinery, and other industrial applications.
Industrial PCB Assembly focuses on providing robust and reliable electronic assemblies that can withstand harsh operating environments, and electromagnetic interference (EMI). It also incorporates components and design considerations that meet the stringent demands of industrial applications.
Advantages of Industrial PCB Assembly:
- Rugged and Durable Design: Industrial Assembly emphasizes the use of durable materials, robust components, and ruggedized designs to ensure reliability in demanding industrial environments. The PCBs are designed to withstand temperature fluctuations, vibrations, shocks, and exposure to dust, moisture, and also corrosive substances.
- Extended Temperature Range: Industrial PCB considers the extended temperature ranges often encountered in industrial settings. The selection of components, soldering techniques, and PCB materials are optimized to operate reliably across a wide temperature range. This also ensures consistent performance under extreme conditions.
- EMI/EMC Compliance: Industrial environments are prone to electromagnetic interference (EMI) and require electronic assemblies to comply with electromagnetic compatibility (EMC) standards. Industrial PCB incorporates shielding techniques, grounding strategies, and component placement considerations to minimize EMI and ensure compliance with regulatory requirements.
- High Component Reliability: Industrial PCB Assembly utilizes components known for their reliability and longevity. Industrial-grade components with extended lifecycles, higher temperature ratings, and enhanced resistance to environmental factors are selected to ensure the longevity and consistent performance of the assembled PCBs.
- Robust Power Management: Industrial applications often require efficient power management and distribution. Industrial PCB incorporates power management components, such as voltage regulators, to ensure stable and clean power supply to the system. This also minimize the risk of voltage fluctuations or power surges.
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers – 6 layers | 6th floor – 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm–6.00mm | 0.2mm–8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm–6.00mm | 0.076mm–0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um–175um | 8.75um–280um |
| Inner layer copper thickness | 17.5um–175um | 0.15mm–0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm–6.00mm | 0.15mm–0.25mm |
| Hole diameter (mechanical drill) | 0.20mm–6.00mm | 0.10mm–0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm–0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Automatic Solder Paste Printing Machine
AOI Optical Inspection
Smt High-Speed Placement Machine
Nitrogen Reflow Soldering
X-Ray
Three Anti-Paint Spraying Machine
SPI Solder Paste Thickness Tester
Automatic Wave Soldering Machine
First Article Inspection
