HDI PCB

HDI PCB

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Car driving recorder HDI PCB

Автомобильный регистратор HDI PCB

Название: Автомобильный регистратор HDI PCB

Уровень: 1+6+1

Лист: EM825

Толщина пластины: 1,6 мм

Размер: 242 мм*165 мм

Минимальное глухое отверстие: 0,1 мм.

Мин. закопанный через: 0,25 мм

Минимальная ширина линии: 0,088 мм

Минимальный межстрочный интервал: 0,087 мм.

Обработка поверхности: Иммерсионное золото

Допуск контура: +/- 0,1 мм

Особые требования: отверстия для заглушек из смолы L3-L6.

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10-layer 1-stage HDI communication PCB

10-слойная 1-ступенчатая плата связи HDI

Название: 10-слойная 1-ступенчатая печатная плата связи HDI

Слои: 1+8+1

Лист: ФР4 Тг170

Толщина пластины: 1,2 мм

Размер панели: 110,8*94,8 мм/4

Внешняя толщина меди: 35 мкм

Толщина меди внутреннего слоя: 18 мкм.

Минимальное сквозное отверстие: 0,20 мм.

Минимальное глухое отверстие: 0,10 мм.

Минимальный BGA: 0,20 мм

Ширина линии и межстрочный интервал: 2,5/2,2 мил.

Обработка поверхности: Иммерсионное золото 2μ”+OSP

Область применения: связь

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6L 2+N+2 HDI Communication PCB

6L 2+N+2 Плата связи HDI

Название: коммуникационная плата 6L 2+N+2 HDI

Модель: плата связи 2+N+2 HDI

Слои: 6 слоев

Материал: ИТ150

Конструкция: печатная плата 2+2+2 HDI

Готовая толщина: 0,8 мм

Толщина меди: 0,5 унции

Цвет: Зеленый/Белый

Обработка поверхности: Иммерсионное золото+OSP

Минимальная трассировка/пространство: 3 мил/3 мил

Минимальное отверстие: лазерное отверстие 0,1 мм

Применение: PCB связи HDI

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6L 2+N+2 Плата модуля Wi-Fi HDI

Название: печатная плата модуля Wi-Fi 6L 2+N+2 HDI

Слои: 6 слоев

Материал: ФР4 Тг170

Конструкция: печатная плата 2+2+2 HDI

Готовая толщина: 0,8 мм

Толщина меди: 1 унция

Цвет: черный/белый

Обработка поверхности: Иммерсионное золото+OSP

Минимальная трассировка/пространство: 3 мил/3 мил

Минимальное отверстие: лазерное отверстие 0,1 мм

Применение: печатная плата модуля Wi-Fi

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6-layer 1-stage HDI PCB

6-слойная 1-ступенчатая печатная плата HDI

Название: 6-слойная 1-ступенчатая печатная плата HDI

Слои: 1+4+1

Лист: ФР4 Тг150

Толщина пластины: 1,6 мм

Размер панели 105*95 мм/1

Внешняя толщина меди: 35 мкм

Толщина меди внутреннего слоя: 30 мкм.

Минимальное сквозное отверстие: 0,20 мм.

Минимальное глухое отверстие: 0,10 мм.

Минимальный BGA: 0,20 мм

Ширина линии, межстрочный интервал: 3/3 мил.

Обработка поверхности: Иммерсионное золото 2μ”+OSP

Область применения: промышленный контроль

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10-layer 3-stage HDI PCB

10-слойная 3-ступенчатая печатная плата HDI

Название: 10-слойная 3-ступенчатая печатная плата HDI

Слои: 3+4+3

Лист: ФР4 Тг170

Толщина пластины: 1,2 мм

Размер панели: 126*118 мм/4

Внешняя толщина меди: 35 мкм

Толщина меди внутреннего слоя: 18 мкм.

Минимальное сквозное отверстие: 0,20 мм.

Минимальное глухое отверстие: 0,10 мм.

Минимальный BGA: 0,25 мм

Ширина линии и интервал: 2,8/3,2 мил.

Обработка поверхности: Иммерсионное золото 2μ”+OSP

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  • HDI PCB Capability
  • PCB manufacturing equipment

Introducing our high-density interconnect printed circuit boards (HDI PCB), the epitome of cutting-edge technology in the world of electronics. Designed to meet the demands of modern electronic devices, our HDI PCBs offer superior performance, reliability, and miniaturization capabilities.

Our HDI PCBs are meticulously engineered using advanced manufacturing processes and materials, resulting in a compact design with highly efficient interconnections.

These PCBs boast a high circuit density, enabling the integration of numerous components within a smaller footprint. Whether you are working on smartphones, tablets, wearable devices, or any other compact electronic device, our HDI PCBs provide the ideal solution.

Advantages of HDI PCB:

  1. Enhanced Miniaturization: HDI PCBs are renowned for their ability to pack more circuitry into smaller form factors. By utilizing advanced microvia and fine-pitch technologies, HDI PCBs significantly reduce the overall size and weight of electronic devices, allowing for sleek and compact designs.
  2. Increased Signal Integrity: With HDI PCBs, signal integrity is greatly improved. The shorter trace lengths and reduced electromagnetic interference (EMI) result in minimal signal loss and noise, ensuring reliable and high-quality performance of the electronic device.
  3. Improved Electrical Performance: HDI PCBs offer excellent electrical performance due to their optimized routing and minimized parasitic capacitance and inductance. This leads to faster signal propagation and reduced power consumption, resulting in enhanced overall device efficiency.
  4. Enhanced Reliability: The advanced manufacturing techniques used in HDI PCBs ensure a high level of reliability and durability. These PCBs are resistant to thermal stress, vibration, and mechanical strain. It also makes them ideal for applications that require long-term reliability, such as automotive electronics and medical devices.
  5. Design Flexibility: HDI PCBs provide greater design flexibility, allowing for more complex and advanced circuitry designs. This flexibility enables the integration of multiple functionalities within a single board. It also reduces the need for additional PCBs and enhancing overall system performance.
HDI (High Density Interconnect) PCB Process Capability
Item batch Template
layers 4-16 Layers 4-24 Layers
Plate thickness range 0.6-3.2mm 0.4-6.0mm
highest order 4+N+4 Any layer innterconnected
Minimum laser hole 4mil (0.1mm) 3mil (0.075mm)
Laser process CO2 Laser Machine CO2 Laser Machine
Tg value 140/150/170°C 140/150/170°C
hole copper 12-18μm 12-18μm
Impedance tolerance +/-10% +/-7%
interlayer alignment +/-3mil +/-2mil
Solder Mask Alignment +/-2mil +/-1mil
Minimum line width/line spacing 2.5/2.5mil 2.0/2.0mil
Smallest grommet 2.5mil 2.5mil
Minimum through hole 8mil (0.2mm) 6mil(0.15mm)
smallest micropore 4.0mil 3.0mil
Minimum media thickness 3.0mil 2.0mil
Minimum pad 12mil 10mil
Micropore Aperture Aspect Ratio 1：1 1：2：1
https://www.made-in-pcb.ru/wp-content/uploads/2023/05/PCB-Drilling-machine.webp

PCB Drilling machine

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PCB pattern plating line

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PCB solder mask expose machine

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PCB pattern expose machine

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Strip film etching line

https://www.made-in-pcb.ru/wp-content/uploads/2023/05/Solder-mask-screen-silk-print-machine.webp

Solder mask screen silk print machine

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Solder mask scrubbing line

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PCB Flying Probe Test (FPT)

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Fully automatic exposure machine

Leadsintec
Why choose us?
24-hour customer service

we provide 24-hour service and support, you will receive a reply to your question within 2 hours and a quotation within 24 hours.

timely delivery

Own PCB factory of 50,000 square meters, the monthly output can reach 60,000 square meters, no minimum PCB order requirements

Free DFM service

Before the official production of the PCB, we will conduct a free DFM review service and support free Allegro, Altium, Protel, PADS, OBD, Gerber and other formats.

Quality assurance

We can provide you with high frequency, high TG, high CTI, buried blind via, aluminum based PCB manufacturing, the quality is fully compliant with IPC 610-D standard, testing and quality assurance

Leadsintec
Related Printed Circuit Board Service
Car driving recorder HDI PCB
Car driving recorder HDI PCB

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10-layer 1-stage HDI communication PCB
10-layer 1-stage HDI communication PCB

We support 10-layer 1-stage HDI communication PCB business, Leadsintec is a professional one-stop PCBA...

6L 2+N+2 HDI Communication PCB
6L 2+N+2 HDI Communication PCB

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Related Printed Circuit Board Service
6L 2+N+2 HDI WiFi Module PCB

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6-layer 1-stage HDI PCB
6-layer 1-stage HDI PCB

We support 6-layer 1-stage HDI PCB business, Leadsintec is a professional one-stop PCBA service factor...

10-layer 3-stage HDI PCB
10-layer 3-stage HDI PCB

Leadsintec provides 10-layer 3-stage HDI PCB services. This is a PCBA one-stop assembly factory with s...

Leadsintec
Industries we serve
Industries we serve
Vehicle electronics
Industries we serve
Smart home
Industries we serve
Industrial control
Industries we serve
Artificial intelligence
Industries we serve
Internet of Things
Industries we serve
Medical Electronics
Leadsintec
Frequently Asked Questions about High Density Circuit Boards
1.What does HDI stand for in HDI PCB?
HDI stands for High-Density Interconnect. It refers to the advanced technology used in PCB manufacturing to achieve higher circuit density, miniaturization, and improved performance.
2.What are microvias in HDI PCBs?
Microvias are small plated-through holes used in HDI PCBs to create connections between different layers. These vias have smaller diameters and aspect ratios compared to traditional vias, allowing for higher routing density and more complex interconnections.
3.What are the advantages of using HDI PCBs?
The advantages of HDI PCBs include: Higher component density and miniaturization Improved signal integrity and electrical performance Enhanced thermal management Increased reliability and reduced failure risks Design flexibility for complex layouts Suitable for high-speed and high-frequency applications
4. What applications are HDI PCBs used in?
HDI PCBs find applications in various industries, including: Telecommunications and networking equipment Consumer electronics (e.g., smartphones, tablets, wearables) Automotive electronics (e.g., infotainment systems, ADAS) Medical devices (e.g., implants, diagnostic equipment) Aerospace and defense electronics Industrial automation and control systems
5. Are HDI PCBs more expensive than traditional PCBs?
HDI PCBs often involve more complex manufacturing processes and advanced technologies, which can make them relatively more expensive than traditional PCBs. The cost depends on factors such as the number of layers, microvia types, materials used, and design complexity. However, the benefits of HDI PCBs can outweigh the cost for applications that require high density, miniaturization, and performance.
6. What are the different types of HDI PCBs?
There are different types of HDI PCBs based on their construction and interconnection technologies. Some common types include: 1+N+1: Consists of a core with one build-up layer on each side. 2+N+2: Features a core with two build-up layers on each side. Any-Layer HDI: Utilizes microvias to provide interconnections between any layers, allowing for highly dense layouts and complex routing.
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