Double-Sided PCB Assembly

Двусторонняя печатная плата в сборе для жестких дисков

Название: Двухсторонняя печатная плата для жестких дисков в сборе
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Толщина меди: 0,5-50 унций
Базовый материал: FR4, High TG FR4, CEM-3 и т. д.
Слой: 2-50 слоев и выше
Применение: связь, автомобильный, промышленный контроль и т. д.

Двусторонняя печатная плата для принтеров в сборе

Название: Двусторонняя печатная плата для принтеров в сборе
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Материал: Материал ФР4
Слой: 1-64 слоя
Паяльная маска: Зелёная. Черный. Красный. Желтый. Белый. Синий
Толщина меди: 1 унция
Толщина платы: по индивидуальному заказу

Двусторонняя печатная плата для дорожного покрытия

Название: Двухсторонняя печатная плата, специально разработанная для дорожного покрытия
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Базовый материал: FR-4
Толщина меди: 0,5 унции–5 унций, 0,5-5 унций
Толщина доски: по индивидуальному заказу
приложения: для дорожной системы
Поверхностная обработка: ХАСЛ

Двусторонняя PCB плата для телефонных систем

Название: Двухсторонняя печатная плата телефонной системы
Базовый материал: FR4
Толщина меди: 1 унция
Поверхностная обработка: HASL,ENIG,OSP
Количество слоев: 2
Применение: Электронное устройство
Цвет паяльной маски: синий. зеленый. красный. черный .белый .и т. д.

Светодиодное освещение, двусторонняя сборка печатной платы

Название: Двухсторонняя сборка печатной платы со светодиодной подсветкой
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Поверхностная обработка: HASL БЕЗ СВИНЦА
Размер платы: индивидуальный
Применение: рождественское украшение освещения
Материал: FR4/алюминий/CEM1
Медь: 1-5 унций
Маска припоя: белая/черная/другая по индивидуальному заказу

Надежный производитель двусторонних печатных плат – Leadsintec

Название: Надежный производитель двусторонних печатных плат – Leadsintec
Происхождение: Китай
Сертифицировано: UL, CE, RoHS.
Слой: 1-22 слоя
Поверхностная обработка: HASL\OSP\погружное золото
Базовый материал: FR4/ROGERS/алюминий/высокий TG
Цвет паяльной маски: зеленый. Черный. Красный. Желтый. Белый. Синий. Фиолетовый. Матовый зеленый.


Double-sided PCB assembly is a versatile and reliable electronic manufacturing process that involves the assembly of electronic components on both sides of a printed circuit board (PCB). With components mounted on both the top and bottom surfaces of the PCB, double-sided assembly allows for increased component density and enhanced functionality in electronic devices.

Double-sided PCB offers the capability to accommodate a larger number of electronic components, including integrated circuits (ICs), resistors, capacitors, connectors, and more. The components are mounted using various techniques such as surface mount technology (SMT), through-hole technology (THT), or a combination of both, depending on the design requirements and component specifications.

Advantages of Double-Sided PCB Assembly:

  1. Increased Component Density: Double-sided assembly allows for higher component density compared to single-sided assemblies. Utilizing both sides of the PCB provides more space for placing electronic components, enabling the design of more complex and feature-rich electronic devices.
  2. Enhanced Functionality: The additional space available in double-sided PCB assembly enables the inclusion of additional components, such as sensors, connectors, or specialized ICs, to enhance the functionality of the electronic device. This allows for the implementation of advanced features and improved performance.
  3. Improved Signal Integrity: Double-sided offers better signal integrity compared to single-sided PCBs. Routing signal traces on both sides of the PCB; helps reduce trace lengths and minimize electromagnetic interference (EMI), resulting in improved signal quality and reduced noise.
  4. Design Flexibility: Double-sided assembly provides design flexibility for complex electronic circuits. Designers have the freedom to route traces on both sides of the PCB, allowing for optimized signal flow, efficient power distribution, and effective separation of analog and digital components. This flexibility enables the creation of custom designs tailored to specific requirements.
  5. Ease of Repairs and Modifications: In the event of a faulty component or design change, double-sided PCB assembly offers convenience for repairs and modifications. Components mounted on either side of the PCB can be easily accessed and replaced, minimizing downtime and reducing the need for complete board replacement.
SMT capacity: 19 million points/day
Testing Equipment X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications Pasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB Specifications Substrate size
Substrate thickness
throw rate 1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board Type POP/common board/FPC/rigid-flex board/metal substrate
DIP daily production capacity
DIP plug-in production line 50000 points/day
DIP post welding production line 20000 points/day
DIP test production line 50000pcs PCBA/day
Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month
PCBA processing capability
project Mass processing capability Small batch processing capability
Number of layers (max) 2-18 20-30
Plate type FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet PTFE, PPO, PPE
Rogers,etc Teflon E-65, ect
Sheet mixing 4 layers – 6 layers 6th floor – 8th floor
biggest size 610mm X 1100mm /
Dimensional Accuracy ±0.13mm ±0.10mm
Plate thickness range 0.2mm–6.00mm 0.2mm–8.00mm
Thickness tolerance ( t≥0.8mm) ±8% ±5%
Thickness tolerance (t<0.8mm) ±10% ±8%
Media thickness 0.076mm–6.00mm 0.076mm–0.100mm
Minimum line width 0.10mm 0.075mm
Minimum spacing 0.10mm 0.075mm
Outer copper thickness 8.75um–175um 8.75um–280um
Inner layer copper thickness 17.5um–175um 0.15mm–0.25mm
Drilling hole diameter (mechanical drill) 0.25mm–6.00mm 0.15mm–0.25mm
Hole diameter (mechanical drill) 0.20mm–6.00mm 0.10mm–0.20mm
Hole Tolerance (Mechanical Drill) 0.05mm /
Hole tolerance (mechanical drill) 0.075mm 0.050mm
Laser Drilling Aperture 0.10mm 0.075mm
Plate thickness aperture ratio 10:1 12:1
Solder mask type Photosensitive green, yellow, black, purple, blue, ink /
Minimum Solder Mask Bridge Width 0.10mm 0.075mm
Minimum Solder Mask Isolation Ring 0.05mm 0.025mm
Plug hole diameter 0.25mm–0.60mm 0.60mm-0.80mm
Impedance tolerance ±10% ±5%
Surface treatment type Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board Immersion Tin, OSP

Automatic Solder Paste Printing Machine

AOI Optical Inspection

Smt High-Speed Placement Machine

Nitrogen Reflow Soldering


Three Anti-Paint Spraying Machine

SPI Solder Paste Thickness Tester

Automatic Wave Soldering Machine

First Article Inspection

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